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MR750 SERIES
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4
Figure 5. Maximum Current Ratings
TL, LEAD TEMPERATURE (°C)
0
0
8.0
I
F(AV)
12
20
28
20 60 100 140 18040 80 120 160 200
Figure 6. Maximum Current Ratings
0
0 8.04.0 12 20 28
4.0
16 24 32
IF(AV), AVERAGE FORWARD CURRENT (AMPS)
P
F(AV)
Figure 7. Power Dissipation
, POWER DISSIPATION (WATTS)
5/8"
, AVERAGE FORWARD CURRENT (AMPS)
CAPACITANCE LOADS
8.0
12
16
RESISTIVE INDUCTIVE
LOADS
TA, AMBIENT TEMPERATURE (°C)
0
0
1.0
I
F(AV)
2.0
3.0
4.0
20 60 100 140 18040 80 120 160 200
Figure 8. Steady State Thermal Resistance
f = 60 Hz
, AVERAGE FORWARD CURRENT (AMPS)
RESISTIVE INDUCTIVE LOADS
CAPACITANCE LOADS ? 1
& 3
20
6
1
& 3
20 Iavg
TA(A)
TA(K)
TL(A)
TC(A)
TJ
TC(K)
TL(K)
PF
RS(A)
RL(A)
RJ(A)
RJ(K)
RL(K)
RS(K)
Use of the above model permits junction to lead thermal resistance for
any mounting configuration to be found. Lowest values occur when one
side of the rectifier is brought as close as possible to the heat sink as
shown below. Terms in the model signify:
TA
= Ambient Temperature T
C
= Case Temperature
TL
= Lead Temperature T
J
= Junction Temperature
RS
= Thermal Resistance, Heat Sink to Ambient
RL
= Thermal Resistance, Lead to Heat Sink
RJ
= Thermal Resistance, Junction to Case
PF
= Power Dissipation
(Subscripts A and K refer to anode and cathode sides, respectively.)
Values for thermal resistance components are:
RL
= 40
°C/W/in. Typically and 44°C/W/in Maximum.
RJ
= 2
°C/W typically and 4°C/W Maximum.
Since R
J
is so low, measurements of the case temperature, T
C, will be
approximately equal to junction temperature in practical lead mounted
applications. When used as a 60 Hz rectifierm the slow thermal response
holds TJ(PK)
close to T
J(AVG). Therefore maximum lead temperature may
be found from: TL
= 175
°?RJL
P
F. PF
may be found from Figure 7.
The recommended method of mounting to a P.C. board is shown on the
sketch, where RJA
is approximately 25
°C/W for a 1?1/2" x 1?1/2" copper
surface area. Values of 40°C/W are typical for mounting to terminal strips
or P.C. boards where available surface area is small.
Board Ground Plane
Recommended mounting for half wave circuit
24
28
32
0
0 1/41/8 3/8 5/8 7/8
5.0
1/2 3/4 1.0
L, LEAD LENGTH (INCHES)
R
JL
, THERMAL RESISTANCE,
SINGLE LEAD TO HEAT SINK,
INSIGNIFICANT HEAT FLOW
THROUGH OTHER LEAD
10
15
20
25
30
35
40
24
16
4.0
θ
JUNCTION?TO?LEAD( C/W)
°
BOTH LEADS TO HEAT
SINK WITH LENGTHS
AS SHOWN
3/8"
1/4"
L = 1/8"
5.0
6.0
7.0
I(pk)
= 5 I
avg
I(pk)
= 10 I
avg
I(pk)
= 20 I
avg
10 Iavg
I(pk)
= 5 I
avg
RESISTIVE ? INDUCTIVE LOADS
BOTH LEADS TO HEAT
SINK, EQUAL LENGTH
6
(I
PK/IAVE
= 6.28)
SEE NOTE
RJA
= 40
°C/W
SEE NOTE
RJA
= 25
°C/W
NOTES
THERMAL CIRCUIT MODEL
(For Heat Conduction Through The Leads)
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